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Clicks Technology Debuts Physical Keyboard Smartphone Targeting BlackBerry Nostalgia

Clicks Technology debuts Communicator smartphone with physical keyboard at CES 2026. The $499 device targets BlackBerry nostalgics, with $79 keyboard accessory available.

Siemens and Nvidia Partner on AI-Driven Industrial Revolution

Siemens and Nvidia announce expanded partnership at CES 2026 to revolutionize manufacturing with AI. The collaboration targets production optimization and supply chain management.

LG Previews Humanoid Home Robot Capable of Household Chores

LG Electronics demonstrates CLOiD humanoid robot at CES 2026, designed to perform household chores including folding laundry and fetching items. Technology preview shown.

Qualcomm Snapdragon X2 Elite Targets Premium Laptop Market with 5GHz Performance

Qualcomm unveils Snapdragon X2 Elite processor at CES 2026, delivering 5GHz performance and 80 TOPS AI capability for Windows laptops challenging Intel and AMD.

Nvidia Introduces Vera Rubin Platform with Six Concurrent Chip Designs

Nvidia unveils Vera Rubin AI computing platform at CES 2026, featuring six chips manufactured by TSMC. The successor to Blackwell is already in full production.

Breaking

Chinese AI Models Now Capture 46% of Enterprise API Usage on US Developer Platforms

A CNBC investigation using OpenRouter and Vercel data reveals that Chinese AI models have surged from 11% to as much as 46% of weekly API token usage by US companies.

JadePuffer Becomes World’s First Documented Agentic Ransomware and It Needed Only One Human

Cloud security firm Sysdig has published findings on JadePuffer, the first documented case of agentic ransomware.

OpenAI Launches GPT-5.6 Series with Sol, Terra, and Luna Models After US Government Security Review

OpenAI has publicly launched its GPT-5.6 model series, comprising Sol, Terra, and Luna, following a delay ordered by the US government over national security concerns.

Meltio and Phillips Corporation Deploy Hybrid Metal AM System Aboard USS Essex for RIMPAC 2026

Phillips Corporation and Meltio have deployed a containerised hybrid manufacturing system aboard the USS Essex during RIMPAC 2026.
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