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Rolls-Royce Opens Dedicated Metal Additive Manufacturing Cell for Next-Gen Combat Aircraft

Rolls-Royce has inaugurated a purpose-built metal additive manufacturing development cell at its Bristol defence facility to accelerate 3D-printed component production for the Global Combat Air Programme.

What Is a Microcontroller and How Is It Different from a Computer?

Learn what a microcontroller is and how it differs from a computer. Understand CPU, memory, I/O pins, real-time control, and which to use in your robot project.

Basic Soldering for Robotics: Creating Reliable Connections

Learn basic soldering for robotics—choose the right iron and solder, master the perfect joint technique, fix common mistakes, and solder headers, wires, and perfboard safely.

From Breadboard to Permanent Circuit: Next Steps in Robot Building

Learn how to move robot circuits from breadboard to permanent form—compare perfboard, stripboard, terminal blocks, and custom PCBs with step-by-step guidance.

Understanding Breadboards: Your Temporary Circuit Testing Space

Master breadboard use for robotics—learn internal connections, power rails, component placement, common mistakes, and how to prototype circuits reliably before soldering.

Breaking

Chinese AI Models Now Capture 46% of Enterprise API Usage on US Developer Platforms

A CNBC investigation using OpenRouter and Vercel data reveals that Chinese AI models have surged from 11% to as much as 46% of weekly API token usage by US companies.

JadePuffer Becomes World’s First Documented Agentic Ransomware and It Needed Only One Human

Cloud security firm Sysdig has published findings on JadePuffer, the first documented case of agentic ransomware.

OpenAI Launches GPT-5.6 Series with Sol, Terra, and Luna Models After US Government Security Review

OpenAI has publicly launched its GPT-5.6 model series, comprising Sol, Terra, and Luna, following a delay ordered by the US government over national security concerns.

Meltio and Phillips Corporation Deploy Hybrid Metal AM System Aboard USS Essex for RIMPAC 2026

Phillips Corporation and Meltio have deployed a containerised hybrid manufacturing system aboard the USS Essex during RIMPAC 2026.
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